Low-power consumption photocoupler supports transfer rates up to 15Mbps.
Dsseldorf, Germany – January 30, 2014 /MarketersMedia/ —
Toshiba Electronics Europe (TEE) has launched two new photocouplers housed in ultra-miniature SO6 and SO8 packages that combine high-speed communication with low power consumption. TLP2361 and TLP2161 will find application in factory networking, high-speed digital interfacing for instrumentation and control devices, as well as in I/O interface boards.
By employing Toshiba’s proprietary high-reliability, high-output GaAlAs (MQW) infrared light-emitting diodes, operation is guaranteed from -40?C to an industry-leading temperature rating of 125?C.
The LED’s high output and reliability enables low threshold input current of just 1.6mA (max.), a reduction of 54% compared with equivalent products such as Toshiba’s TLP2366 and TLP2160. Supply current per channel is reduced to 1.0mA per channel, a reduction of 66% for TLP2361 and 60% for TLP2161 compared to conventional products.
The lower input current rating means that the photocouplers can be driven directly by the microprocessor without requiring a buffer, which contributes to lower power consumption, lower component count and reduced costs. In order to accommodate the trend towards lower power voltages, the receiver IC characteristics are guaranteed over a power voltage range from 2.7 to 5.5V.
TLP2361 comes in a compact SO6 package with guaranteed clearance and creepage distance of min. 5mm, and with an insulation voltage of 3750Vrms. This is compliant with the reinforced insulation class of various safety standards.
TLP2161 combines two circuits into an S08 package, reducing mounting area by approximately 40%, compared with two TLP2361 units – further contributing to downsizing and reducing PCB cost. Its insulation voltage is rated with min. 2500Vrms.
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry’s broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products like HDDs, SSDs, SD Cards and USB sticks.
TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Dsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa.